TEMfilter - RF/Microwave Design Software for filters.
Where Synthesis enables Analysis™

Software Product: TEMfilter - TEM filter analysis (Bsndpass & Bandstop)

Atlanta RF Software offers RF/microwave CAE software product: TEMfilter, which performs a Frequency Analysis of multi-section non-dispersive (TEM-mode) Bandpass and/or Bandstop Filters, and includes the following product features:

1. Frequency Analysis of multi-section TEM-mode Filter designs:
   1. Frequency Analysis of multi-section Bandpass Filters.
   2. Frequency Analysis of multi-section Bandstop Filters.
   3. Frequency Analysis of Bandpass & Bandstop Filters (both).
2. Frequency Analysis of various Filter Design Options:
   1. Chebyshev frequency response.
   2. Butterworth Frequency response.
   3. User-defined Unloaded Q (Qu) for predicting Insertion Loss.
3. Frequency Analysis response profile of:
   1. Wavelength and Input VSWR.
   2. Insertion Loss & Insertion Phase.
   3. Time Delay versus Frequency.
4. Output Data stored on your hard drive for graphical plots.

​Software product: TEMfilter provides the User with full frequency analysis capability of any multi-section Bandpass Filter or Bandstop Filter operating in the non-dispersive TEM-mode, regardless of the Filter's operating bandwidth. TEMfilter uses pure mathematics, which does not include the construction medium for your Filter.

​Download the User Manual for software product: TEMfilter to view the many features and capabilities that support your RF circuit designs.

Download the DEMO software product: TEMfilter-DEMO to explore the functions available and solutions offered to ease your everyday workload.

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Key Specifications for Bandpass & Bandstop Filters:

• Frequency specs: Center frequency: Fo & Bandwidth: BW, MHz.
• Passband frequency insertion loss, Return Loss and passband ripple level (i.e.: flatness).
• Passband group delay variation vs. frequency, ns.
• Selectivity or skirt sharpness.
• Out-of-band frequency rejection levels, dB.
• Spurious out-of-band response.
• RF power handling capacity.

            – Multipactor effects & voltage breakdown.

• Environmental Specifications:

            – Operational & storage temperature limits.
            – Atmospheric pressure & humidity environments.
            – Shock & vibration levels.

• Mechanical Specifications:

            – Size, shape & weight / mass.
            – Type of input/output connectors.
            – Mechanical mounting interfaces.